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alistair23-linux/Documentation/devicetree/bindings/vendor-prefixes.txt

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Device tree binding vendor prefix registry. Keep list in alphabetical order.
This isn't an exhaustive list, but you should add new prefixes to it before
using them to avoid name-space collisions.
abilis Abilis Systems
abracon Abracon Corporation
actions Actions Semiconductor Co., Ltd.
active-semi Active-Semi International Inc
ad Avionic Design GmbH
adafruit Adafruit Industries, LLC
adapteva Adapteva, Inc.
adaptrum Adaptrum, Inc.
adh AD Holdings Plc.
adi Analog Devices, Inc.
advantech Advantech Corporation
aeroflexgaisler Aeroflex Gaisler AB
al Annapurna Labs
allo Allo.com
allwinner Allwinner Technology Co., Ltd.
alphascale AlphaScale Integrated Circuits Systems, Inc.
altr Altera Corp.
amarula Amarula Solutions
amazon Amazon.com, Inc.
amcc Applied Micro Circuits Corporation (APM, formally AMCC)
amd Advanced Micro Devices (AMD), Inc.
amediatech Shenzhen Amediatech Technology Co., Ltd
amlogic Amlogic, Inc.
ampire Ampire Co., Ltd.
ams AMS AG
amstaos AMS-Taos Inc.
analogix Analogix Semiconductor, Inc.
andestech Andes Technology Corporation
apm Applied Micro Circuits Corporation (APM)
aptina Aptina Imaging
arasan Arasan Chip Systems
archermind ArcherMind Technology (Nanjing) Co., Ltd.
arctic Arctic Sand
aries Aries Embedded GmbH
arm ARM Ltd.
armadeus ARMadeus Systems SARL
arrow Arrow Electronics
artesyn Artesyn Embedded Technologies Inc.
asahi-kasei Asahi Kasei Corp.
aspeed ASPEED Technology Inc.
asus AsusTek Computer Inc.
atlas Atlas Scientific LLC
atmel Atmel Corporation
auo AU Optronics Corporation
auvidea Auvidea GmbH
avago Avago Technologies
avia avia semiconductor
avic Shanghai AVIC Optoelectronics Co., Ltd.
avnet Avnet, Inc.
axentia Axentia Technologies AB
axis Axis Communications AB
bananapi BIPAI KEJI LIMITED
bhf Beckhoff Automation GmbH & Co. KG
bitmain Bitmain Technologies
boe BOE Technology Group Co., Ltd.
bosch Bosch Sensortec GmbH
boundary Boundary Devices Inc.
brcm Broadcom Corporation
buffalo Buffalo, Inc.
bticino Bticino International
calxeda Calxeda
capella Capella Microsystems, Inc
cascoda Cascoda, Ltd.
catalyst Catalyst Semiconductor, Inc.
cavium Cavium, Inc.
cdns Cadence Design Systems Inc.
cdtech CDTech(H.K.) Electronics Limited
ceva Ceva, Inc.
chipidea Chipidea, Inc
chipone ChipOne
chipspark ChipSPARK
chrp Common Hardware Reference Platform
chunghwa Chunghwa Picture Tubes Ltd.
ciaa Computadora Industrial Abierta Argentina
cirrus Cirrus Logic, Inc.
cloudengines Cloud Engines, Inc.
cnm Chips&Media, Inc.
cnxt Conexant Systems, Inc.
compulab CompuLab Ltd.
cortina Cortina Systems, Inc.
cosmic Cosmic Circuits
crane Crane Connectivity Solutions
creative Creative Technology Ltd
crystalfontz Crystalfontz America, Inc.
csky Hangzhou C-SKY Microsystems Co., Ltd
cubietech Cubietech, Ltd.
cypress Cypress Semiconductor Corporation
cznic CZ.NIC, z.s.p.o.
dallas Maxim Integrated Products (formerly Dallas Semiconductor)
dataimage DataImage, Inc.
davicom DAVICOM Semiconductor, Inc.
delta Delta Electronics, Inc.
denx Denx Software Engineering
devantech Devantech, Ltd.
dh DH electronics GmbH
digi Digi International Inc.
digilent Diglent, Inc.
dioo Dioo Microcircuit Co., Ltd
dlc DLC Display Co., Ltd.
dlg Dialog Semiconductor
dlink D-Link Corporation
dmo Data Modul AG
domintech Domintech Co., Ltd.
dongwoon Dongwoon Anatech
dptechnics DPTechnics
dragino Dragino Technology Co., Limited
ea Embedded Artists AB
ebs-systart EBS-SYSTART GmbH
ebv EBV Elektronik
eckelmann Eckelmann AG
edt Emerging Display Technologies
eeti eGalax_eMPIA Technology Inc
elan Elan Microelectronic Corp.
elgin Elgin S/A.
embest Shenzhen Embest Technology Co., Ltd.
emlid Emlid, Ltd.
emmicro EM Microelectronic
emtrion emtrion GmbH
endless Endless Mobile, Inc.
energymicro Silicon Laboratories (formerly Energy Micro AS)
engicam Engicam S.r.l.
epcos EPCOS AG
epfl Ecole Polytechnique Fédérale de Lausanne
epson Seiko Epson Corp.
est ESTeem Wireless Modems
ettus NI Ettus Research
eukrea Eukréa Electromatique
everest Everest Semiconductor Co. Ltd.
everspin Everspin Technologies, Inc.
exar Exar Corporation
excito Excito
ezchip EZchip Semiconductor
facebook Facebook
fairphone Fairphone B.V.
faraday Faraday Technology Corporation
fastrax Fastrax Oy
fcs Fairchild Semiconductor
firefly Firefly
focaltech FocalTech Systems Co.,Ltd
friendlyarm Guangzhou FriendlyARM Computer Tech Co., Ltd
fsl Freescale Semiconductor
fujitsu Fujitsu Ltd.
gcw Game Consoles Worldwide
ge General Electric Company
geekbuying GeekBuying
gef GE Fanuc Intelligent Platforms Embedded Systems, Inc.
GEFanuc GE Fanuc Intelligent Platforms Embedded Systems, Inc.
geniatech Geniatech, Inc.
giantec Giantec Semiconductor, Inc.
giantplus Giantplus Technology Co., Ltd.
globalscale Globalscale Technologies, Inc.
globaltop GlobalTop Technology, Inc.
gmt Global Mixed-mode Technology, Inc.
goodix Shenzhen Huiding Technology Co., Ltd.
google Google, Inc.
grinn Grinn
grmn Garmin Limited
gumstix Gumstix, Inc.
gw Gateworks Corporation
hannstar HannStar Display Corporation
haoyu Haoyu Microelectronic Co. Ltd.
hardkernel Hardkernel Co., Ltd
hideep HiDeep Inc.
himax Himax Technologies, Inc.
hisilicon Hisilicon Limited.
hit Hitachi Ltd.
hitex Hitex Development Tools
holt Holt Integrated Circuits, Inc.
honeywell Honeywell
hp Hewlett Packard
holtek Holtek Semiconductor, Inc.
hwacom HwaCom Systems Inc.
i2se I2SE GmbH
ibm International Business Machines (IBM)
icplus IC Plus Corp.
idt Integrated Device Technologies, Inc.
ifi Ingenieurburo Fur Ic-Technologie (I/F/I)
ilitek ILI Technology Corporation (ILITEK)
img Imagination Technologies Ltd.
infineon Infineon Technologies
inforce Inforce Computing
ingenic Ingenic Semiconductor
innolux Innolux Corporation
inside-secure INSIDE Secure
intel Intel Corporation
intercontrol Inter Control Group
invensense InvenSense Inc.
inversepath Inverse Path
iom Iomega Corporation
isee ISEE 2007 S.L.
isil Intersil
issi Integrated Silicon Solutions Inc.
itead ITEAD Intelligent Systems Co.Ltd
iwave iWave Systems Technologies Pvt. Ltd.
jdi Japan Display Inc.
jedec JEDEC Solid State Technology Association
jianda Jiandangjing Technology Co., Ltd.
karo Ka-Ro electronics GmbH
keithkoep Keith & Koep GmbH
keymile Keymile GmbH
khadas Khadas
kiebackpeter Kieback & Peter GmbH
kinetic Kinetic Technologies
kingdisplay King & Display Technology Co., Ltd.
kingnovel Kingnovel Technology Co., Ltd.
koe Kaohsiung Opto-Electronics Inc.
kosagi Sutajio Ko-Usagi PTE Ltd.
kyo Kyocera Corporation
lacie LaCie
laird Laird PLC
lantiq Lantiq Semiconductor
lattice Lattice Semiconductor
lego LEGO Systems A/S
lenovo Lenovo Group Ltd.
lg LG Corporation
libretech Shenzhen Libre Technology Co., Ltd
licheepi Lichee Pi
linaro Linaro Limited
linksys Belkin International, Inc. (Linksys)
linux Linux-specific binding
linx Linx Technologies
lltc Linear Technology Corporation
logicpd Logic PD, Inc.
lsi LSI Corp. (LSI Logic)
lwn Liebherr-Werk Nenzing GmbH
macnica Macnica Americas
marvell Marvell Technology Group Ltd.
maxim Maxim Integrated Products
mbvl Mobiveil Inc.
mcube mCube
meas Measurement Specialties
mediatek MediaTek Inc.
megachips MegaChips
mele Shenzhen MeLE Digital Technology Ltd.
melexis Melexis N.V.
melfas MELFAS Inc.
mellanox Mellanox Technologies
memsic MEMSIC Inc.
merrii Merrii Technology Co., Ltd.
micrel Micrel Inc.
microchip Microchip Technology Inc.
microcrystal Micro Crystal AG
micron Micron Technology Inc.
mikroe MikroElektronika d.o.o.
minix MINIX Technology Ltd.
miramems MiraMEMS Sensing Technology Co., Ltd.
mitsubishi Mitsubishi Electric Corporation
mosaixtech Mosaix Technologies, Inc.
motorola Motorola, Inc.
moxa Moxa Inc.
mpl MPL AG
mqmaker mqmaker Inc.
mscc Microsemi Corporation
msi Micro-Star International Co. Ltd.
mti Imagination Technologies Ltd. (formerly MIPS Technologies Inc.)
multi-inno Multi-Inno Technology Co.,Ltd
mundoreader Mundo Reader S.L.
murata Murata Manufacturing Co., Ltd.
mxicy Macronix International Co., Ltd.
myir MYIR Tech Limited
national National Semiconductor
nec NEC LCD Technologies, Ltd.
neonode Neonode Inc.
netgear NETGEAR
netlogic Broadcom Corporation (formerly NetLogic Microsystems)
netron-dy Netron DY
netxeon Shenzhen Netxeon Technology CO., LTD
nexbox Nexbox
nextthing Next Thing Co.
newhaven Newhaven Display International
ni National Instruments
nintendo Nintendo
nlt NLT Technologies, Ltd.
nokia Nokia
nordic Nordic Semiconductor
novtech NovTech, Inc.
nutsboard NutsBoard
nuvoton Nuvoton Technology Corporation
DeviceTree updates for 4.10: - Add various vendor prefixes. - Fix NUMA node handling when "numa=off" is passed on kernel command line. - Coding style Clean-up of overlay handling code. - DocBook fixes in DT platform driver code - Altera SoCFPGA binding addtions for freeze bridge, arria10 FPGA manager and FPGA bridges. - Couple of printk message fixes. -----BEGIN PGP SIGNATURE----- iQItBAABCAAXBQJYUqo6EBxyb2JoQGtlcm5lbC5vcmcACgkQ+vtdtY28YcMHiw// WIJH6XF8PkAEkITxChwb3kJ1y7PCtR7YmncMvnMRh9kIcyPwFjiDRqUz/0MiTHgD UJsFtX6057GWDd0mlUrQ8iFFlzdGLl2Xw4u6sr4bC7bGVK0Nj9QX+xrFmXCLtGj0 wYkXIJXDXmLQJPKhG5np5jBYfJIaYr5FcNCwdOEljDDauHAg6f2hvgOby1X8FCOS oC3LCqvx4SWp9EcQAvOkKAJazsIlSAynb7EFwTaKo0RHJPzX/Uhp7RmyvAgeVZVE a2GS+YwboD3PMa7cjC3R7FwBXhuM/YQLLWfgSGwvr8nADP4a/iZNzJt1H0rU1LKP ukgSP5m58bt713H7Gr6OJ1ygAFmvFAzye+mXwHVxwqg3BFp141LCKoD0A2RO+zH8 5cma2OTl9bQSWxtKJyLm4y9/QegaThyM/eZyk5j6XOjIEtlTS0h8H3ZHbU55k1HC 7MJrnoAb3z5vGhxPplF1MOeGswz5vLME0e74Po0Nt8X7sdpj7zVWBL8AZh+Xyw2O d6oz9xYQVgJ5mqnnXXTWSqNfTM82+aUZV6SREaOJ1GjSy3pfd2s85N1oB8oIOb+o gRNYibbv/EvaOBqADwQoRWRTIW+0Vtf/vY1xVFB6Wd8XO2a/dmHZJ95jaPlAfwf3 l5EqgsHP1kirkNYgCAUSpCkPf61gA+ZAWxjlfrARmCg= =1Sex -----END PGP SIGNATURE----- Merge tag 'devicetree-for-4.10' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux Pull DeviceTree updates from Rob Herring: - add various vendor prefixes. - fix NUMA node handling when "numa=off" is passed on kernel command line. - coding style Clean-up of overlay handling code. - DocBook fixes in DT platform driver code - Altera SoCFPGA binding addtions for freeze bridge, arria10 FPGA manager and FPGA bridges. - a couple of printk message fixes. * tag 'devicetree-for-4.10' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (33 commits) dt: pwm: bcm2835: fix typo in clocks property name devicetree: add vendor prefix for National Instruments Revert "of: base: add support to get machine model name" of: Fix issue where code would fall through to error case. drivers/of: fix missing pr_cont()s in of_print_phandle_args devicetree: bindings: Add vendor prefix for Oki devicetree: bindings: Add vendor prefix for Andes Technology Corporation dt-bindings: add MYIR Tech hardware vendor prefix add bindings document for altera freeze bridge ARM: socfpga: add bindings doc for arria10 fpga manager ARM: socfpga: add bindings document for fpga bridge drivers of: base: add support to get machine model name of/platform: clarify of_find_device_by_node refcounting of/platform: fix of_platform_device_destroy comment of: Remove unused variable overlay_symbols of: Move setting of pointer to beside test for non-null of: Add back an error message, restructured of: Update comments to reflect changes and increase clarity of: Remove redundant size check of: Update structure of code to be clearer, also remove BUG_ON() ...
2016-12-15 12:49:41 -07:00
nvd New Vision Display
nvidia NVIDIA
nxp NXP Semiconductors
okaya Okaya Electric America, Inc.
oki Oki Electric Industry Co., Ltd.
olimex OLIMEX Ltd.
olpc One Laptop Per Child
onion Onion Corporation
onnn ON Semiconductor Corp.
ontat On Tat Industrial Company
opalkelly Opal Kelly Incorporated
opencores OpenCores.org
openrisc OpenRISC.io
option Option NV
oranth Shenzhen Oranth Technology Co., Ltd.
ORCL Oracle Corporation
orisetech Orise Technology
ortustech Ortus Technology Co., Ltd.
ovti OmniVision Technologies
oxsemi Oxford Semiconductor, Ltd.
panasonic Panasonic Corporation
parade Parade Technologies Inc.
pericom Pericom Technology Inc.
pervasive Pervasive Displays, Inc.
phicomm PHICOMM Co., Ltd.
phytec PHYTEC Messtechnik GmbH
picochip Picochip Ltd
pine64 Pine64
pixcir PIXCIR MICROELECTRONICS Co., Ltd
plathome Plat'Home Co., Ltd.
plda PLDA
plx Broadcom Corporation (formerly PLX Technology)
First set of new device support, features and cleanups for IIO in the 4.21 cycle Along with the headline feature of 5 new drivers, we have the substantial addition of auxilliary sensor support on the lsm6sdx parts for ST. There has also been a good set of staging cleanup in this period with more underway. An ever increasing number of devices supported with just a new ID which is a good sign that at least some manufacturers are continuing to stabilise their interfaces. New device support, * ad7124 - New driver supporting Analog Devices' ad7124-4 and ad7124-8 parts with the inevitable DT binding. * ad7949 - New driver supporting Analog Devices' ad7949, AD7682 and AD7689 ADCs. * rm3100 - New driver supporting PNIs RM3100 magnometer with bindings and vendor prefix. * ti-dac7311 - New driver supporting DAC7311, DAC6311 and DAC5311 TI DACs, with DT bindings. * vcnl5035 - New driver supporting the light sensor part of the VCNL4035, with DT bindings Features, * bindings - Add a generic ADC channel binding as we keep reinventing this wheel. * adc128s052 - Add IDs for additional pin compatible parts. - Add APCI ID seen on E3940 UP squared boards. * ad_sigma_delta - Allow for custom data register overiding default. * kxcjk1013 - Add KIOX0009 ACPI ID as seen on the Acer One 10. * lsm6dsx - Rework leading to... - External sensor support using the built in I2C master. - Initial support for a slave lis2mdl magnetometer. * meson-saradc - Add temperature sensor support and bindings. * st_magn - New ID for lsm9dsl_magn with bindings - New ID for lis3de accelerometer * tpl0102 - Add supprot for IIO_AVAIL_RANGE to report the range available from this device to userspace and in kernel users. Cleanups and minor fixes * tools - Allow outside specification of CFLAGS * ad2s90 - Handle and spi_read error. - Handle spi_setup failure - Drop a pointless assignment. - Prevent a potentail race by moving device registration to after all other setup. - Add missing scale attribute. - Add a sanity check on channel type before trying to read it. * ad2s1210 - Move to modern gpio descriptors. - Drop a gpioin flag which made no sense as far as we can tell. - Add dt table (bindings doc to follow when this is ready for moving out of staging). * ad5933 - Drop camel-case naming of ext_clk_hz. - White space fixes. * ad7150 - Local variable to shorten overly long line. - Alignment and line break fixes. * ad7280a - Handle an error path that was previously ignored. - Use crc8.h to build the crc table replacing custom code. - Avoid unecessary cast. - Power down the device if an error happens in probe - Use devm routines to simplify probe and remove. * ad7606 - Alignment fixes. * ad7780 - This worked as long as by coincidence an uninitialized value was 0. Lets not rely on that. - Ensure gain update is only used with the ad778x chips that actually support it. - Tidy up pattern mask generation. - Read regulator when scale is requested (which should be infrequent) as it might have changed from initialization. * ad7816 - Move to modern gpio descriptors - Don't use a busy_pin for ad7818 as there isn't one. - Ensure RD/WR and CONVST pins are outputs (previously they were brought up as inputs which doesn't seem to make any sense) - DT id table. * adc128s052 - SPDX * adt7316 - Alignment fix. - Fix data reading. When using I2C the driver never actually used the value read. This has been broken a very long time hence no rush to fix it now + the driver is undergoing a lot of cleanup. - Sanity check that the i2c read didn't fail to actually read anything. * dpot-dac - Mark a switch full through with slightly different text so that gcc doesn't warn on it. * gyro-adc - Fix a wrong file in the MAINTAINERS entry and add binding doc to the listed files. * ina2xx - Add some early returns to clarify error paths in switch. * lsm6dsx - MAINTAINERS entry. * max11100 - SPDX * max9611 - SPDX * mcp4131 - use of_device_get_match_data in preference to spi_get_device_id approach. * rcar-adc - SPDX * sc27xx - Add ADC conversion timeout support to avoid possible fault. * ssp_sensors - Don't free managed resources manually. * st-magn - Add a comment to avoid future confusion over when to use -magn postfix (on multi chip in package parts) - Add BDU register for LIS3MDL where it seems to have been missed. * st-sensors - Minor spelling, grammar etc fixes. * tpl0102 - Use a pointer rather than an index of an array to improve conciseness. -----BEGIN PGP SIGNATURE----- iQJFBAABCAAvFiEEbilms4eEBlKRJoGxVIU0mcT0FogFAlv1wDARHGppYzIzQGtl cm5lbC5vcmcACgkQVIU0mcT0Fohf9Q//fzNk9RoY98awaEmHRW7PLnHe1WKyQTV5 M13EaFwm/NeWfT1kaNd/heZDnwucB34ONrcueNcM8MfwzPwWaL9UvSqEnSWIuTae hKdn/BMTfy168xhu95YPjHw4X42HwcXYlHL9XFsA0WERgaWsQu2EwIy1/3XRgIrt QPQVyJNUkLZmBuGcd2UhxzdTiLuh/hs7FFBg037hxaR77slWYKqAzwVa6eyz/jvo tRT9RE50O1FT3eDkBSw91nkamFcmFyyA2j4HQ33Aitjs5O1ML95xEJ0tMAznZfKn zAGCCUJjFYBvWPOpQ8xBA3tplFRGIyVhPJ5ZU+B2vZcxVXQ3IFZNqKRXfrUkAXpf PK2+05+HjHk1g7Ms1Tj4lF5AtP/nEQ8dvmGk6/nDU7Gt4Ytrpb0DhAuMGmN4S5ih zwwh+c6fLGCMz7KE8AoegOn3WF/FW1ZppTRjOWgqt7OP6lgoChPuTV5HGzxiZgr+ MzY/fytbXTnmfTL1ZvZYPdOSjkHcS9+8rwu1Jirmb1Y5Qt3qpNAUsdsnt965mQaE bHmuqw8QJN31goTEsqvjnsFhH57dJ1HbmG0MSrF8XB0bQB5Xzbkd+RV4fls1J+SG XwpIzQLhPxF5da6G+I/SIgLX6nASacJp9hHEN/ZuM3IKr2UW8FCpCH6JmyX0i6OU dPjHsXrGTuI= =78Y3 -----END PGP SIGNATURE----- Merge tag 'iio-for-4.21a' of git://git.kernel.org/pub/scm/linux/kernel/git/jic23/iio into staging-testing Jonathan writes: First set of new device support, features and cleanups for IIO in the 4.21 cycle Along with the headline feature of 5 new drivers, we have the substantial addition of auxilliary sensor support on the lsm6sdx parts for ST. There has also been a good set of staging cleanup in this period with more underway. An ever increasing number of devices supported with just a new ID which is a good sign that at least some manufacturers are continuing to stabilise their interfaces. New device support, * ad7124 - New driver supporting Analog Devices' ad7124-4 and ad7124-8 parts with the inevitable DT binding. * ad7949 - New driver supporting Analog Devices' ad7949, AD7682 and AD7689 ADCs. * rm3100 - New driver supporting PNIs RM3100 magnometer with bindings and vendor prefix. * ti-dac7311 - New driver supporting DAC7311, DAC6311 and DAC5311 TI DACs, with DT bindings. * vcnl5035 - New driver supporting the light sensor part of the VCNL4035, with DT bindings Features, * bindings - Add a generic ADC channel binding as we keep reinventing this wheel. * adc128s052 - Add IDs for additional pin compatible parts. - Add APCI ID seen on E3940 UP squared boards. * ad_sigma_delta - Allow for custom data register overiding default. * kxcjk1013 - Add KIOX0009 ACPI ID as seen on the Acer One 10. * lsm6dsx - Rework leading to... - External sensor support using the built in I2C master. - Initial support for a slave lis2mdl magnetometer. * meson-saradc - Add temperature sensor support and bindings. * st_magn - New ID for lsm9dsl_magn with bindings - New ID for lis3de accelerometer * tpl0102 - Add supprot for IIO_AVAIL_RANGE to report the range available from this device to userspace and in kernel users. Cleanups and minor fixes * tools - Allow outside specification of CFLAGS * ad2s90 - Handle and spi_read error. - Handle spi_setup failure - Drop a pointless assignment. - Prevent a potentail race by moving device registration to after all other setup. - Add missing scale attribute. - Add a sanity check on channel type before trying to read it. * ad2s1210 - Move to modern gpio descriptors. - Drop a gpioin flag which made no sense as far as we can tell. - Add dt table (bindings doc to follow when this is ready for moving out of staging). * ad5933 - Drop camel-case naming of ext_clk_hz. - White space fixes. * ad7150 - Local variable to shorten overly long line. - Alignment and line break fixes. * ad7280a - Handle an error path that was previously ignored. - Use crc8.h to build the crc table replacing custom code. - Avoid unecessary cast. - Power down the device if an error happens in probe - Use devm routines to simplify probe and remove. * ad7606 - Alignment fixes. * ad7780 - This worked as long as by coincidence an uninitialized value was 0. Lets not rely on that. - Ensure gain update is only used with the ad778x chips that actually support it. - Tidy up pattern mask generation. - Read regulator when scale is requested (which should be infrequent) as it might have changed from initialization. * ad7816 - Move to modern gpio descriptors - Don't use a busy_pin for ad7818 as there isn't one. - Ensure RD/WR and CONVST pins are outputs (previously they were brought up as inputs which doesn't seem to make any sense) - DT id table. * adc128s052 - SPDX * adt7316 - Alignment fix. - Fix data reading. When using I2C the driver never actually used the value read. This has been broken a very long time hence no rush to fix it now + the driver is undergoing a lot of cleanup. - Sanity check that the i2c read didn't fail to actually read anything. * dpot-dac - Mark a switch full through with slightly different text so that gcc doesn't warn on it. * gyro-adc - Fix a wrong file in the MAINTAINERS entry and add binding doc to the listed files. * ina2xx - Add some early returns to clarify error paths in switch. * lsm6dsx - MAINTAINERS entry. * max11100 - SPDX * max9611 - SPDX * mcp4131 - use of_device_get_match_data in preference to spi_get_device_id approach. * rcar-adc - SPDX * sc27xx - Add ADC conversion timeout support to avoid possible fault. * ssp_sensors - Don't free managed resources manually. * st-magn - Add a comment to avoid future confusion over when to use -magn postfix (on multi chip in package parts) - Add BDU register for LIS3MDL where it seems to have been missed. * st-sensors - Minor spelling, grammar etc fixes. * tpl0102 - Use a pointer rather than an index of an array to improve conciseness. * tag 'iio-for-4.21a' of git://git.kernel.org/pub/scm/linux/kernel/git/jic23/iio: (80 commits) Staging: iio: adt7316: Add an extra check for 'ret' equals to 0 Staging: iio: adt7316: Fix i2c data reading, set the data field dt-bindings: iio: adc: Add docs for ad7124 iio: adc: Add ad7124 support dt-bindings: iio: adc: Add common ADCs properties to a separate file iio: ad_sigma_delta: Allow to provide custom data register address staging: iio: ad7816: Add device tree table. iio: imu: st_lsm6dsx: add entry in MAINTAINERS file iio: potentiometer: mcp4131: use of_device_get_match_data() staging: iio: adc: ad7280a: use devm_* APIs staging: iio: adc: ad7280a: power down the device on error in probe dt-bindings: iio: imu: st_lsm6dsx: add support to i2c pullup resistors iio: imu: st_lsm6dsx: add hw FIFO support to i2c controller iio: imu: st_lsm6dsx: add st_lsm6dsx_push_tagged_data routine iio: imu: st_lsm6dsx: add i2c embedded controller support iio: imu: st_lsm6dsx: introduce st_lsm6dsx_sensor_set_enable routine iio: imu: st_lsm6dsx: introduce ST_LSM6DSX_ID_EXT sensor ids iio: imu: st_lsm6dsx: remove static from st_lsm6dsx_set_watermark iio: imu: st_lsm6dsx: reload trimming parameter at bootstrap iio: imu: st_lsm6dsx: introduce locked read/write utility routines ...
2018-11-22 01:39:45 -07:00
pni PNI Sensor Corporation
portwell Portwell Inc.
poslab Poslab Technology Co., Ltd.
powervr PowerVR (deprecated, use img)
probox2 PROBOX2 (by W2COMP Co., Ltd.)
pulsedlight PulsedLight, Inc
qca Qualcomm Atheros, Inc.
qcom Qualcomm Technologies, Inc
qemu QEMU, a generic and open source machine emulator and virtualizer
qi Qi Hardware
qiaodian QiaoDian XianShi Corporation
qnap QNAP Systems, Inc.
radxa Radxa
raidsonic RaidSonic Technology GmbH
ralink Mediatek/Ralink Technology Corp.
ramtron Ramtron International
raspberrypi Raspberry Pi Foundation
raydium Raydium Semiconductor Corp.
rda Unisoc Communications, Inc.
realtek Realtek Semiconductor Corp.
renesas Renesas Electronics Corporation
richtek Richtek Technology Corporation
ricoh Ricoh Co. Ltd.
rikomagic Rikomagic Tech Corp. Ltd
riscv RISC-V Foundation
rockchip Fuzhou Rockchip Electronics Co., Ltd
rohm ROHM Semiconductor Co., Ltd
roofull Shenzhen Roofull Technology Co, Ltd
samsung Samsung Semiconductor
samtec Samtec/Softing company
sancloud Sancloud Ltd
sandisk Sandisk Corporation
sbs Smart Battery System
schindler Schindler
seagate Seagate Technology PLC
semtech Semtech Corporation
sensirion Sensirion AG
sff Small Form Factor Committee
sgd Solomon Goldentek Display Corporation
sgx SGX Sensortech
sharp Sharp Corporation
shimafuji Shimafuji Electric, Inc.
si-en Si-En Technology Ltd.
sifive SiFive, Inc.
sigma Sigma Designs, Inc.
sii Seiko Instruments, Inc.
sil Silicon Image
silabs Silicon Laboratories
silead Silead Inc.
silergy Silergy Corp.
siliconmitus Silicon Mitus, Inc.
simtek
sirf SiRF Technology, Inc.
sis Silicon Integrated Systems Corp.
sitronix Sitronix Technology Corporation
skyworks Skyworks Solutions, Inc.
smsc Standard Microsystems Corporation
snps Synopsys, Inc.
socionext Socionext Inc.
solidrun SolidRun
solomon Solomon Systech Limited
sony Sony Corporation
spansion Spansion Inc.
sprd Spreadtrum Communications Inc.
sst Silicon Storage Technology, Inc.
st STMicroelectronics
starry Starry Electronic Technology (ShenZhen) Co., LTD
startek Startek
ste ST-Ericsson
stericsson ST-Ericsson
summit Summit microelectronics
sunchip Shenzhen Sunchip Technology Co., Ltd
SUNW Sun Microsystems, Inc
swir Sierra Wireless
syna Synaptics Inc.
synology Synology, Inc.
tbs TBS Technologies
tbs-biometrics Touchless Biometric Systems AG
tcg Trusted Computing Group
tcl Toby Churchill Ltd.
technexion TechNexion
technologic Technologic Systems
tempo Tempo Semiconductor
terasic Terasic Inc.
thine THine Electronics, Inc.
ti Texas Instruments
tianma Tianma Micro-electronics Co., Ltd.
tlm Trusted Logic Mobility
tmt Tecon Microprocessor Technologies, LLC.
topeet Topeet
toradex Toradex AG
toshiba Toshiba Corporation
toumaz Toumaz
tpk TPK U.S.A. LLC
tplink TP-LINK Technologies Co., Ltd.
tpo TPO
tronfy Tronfy
tronsmart Tronsmart
truly Truly Semiconductors Limited
tsd Theobroma Systems Design und Consulting GmbH
tyan Tyan Computer Corporation
u-blox u-blox
ucrobotics uCRobotics
ubnt Ubiquiti Networks
udoo Udoo
uniwest United Western Technologies Corp (UniWest)
upisemi uPI Semiconductor Corp.
urt United Radiant Technology Corporation
usi Universal Scientific Industrial Co., Ltd.
v3 V3 Semiconductor
vamrs Vamrs Ltd.
variscite Variscite Ltd.
via VIA Technologies, Inc.
virtio Virtual I/O Device Specification, developed by the OASIS consortium
vishay Vishay Intertechnology, Inc
vitesse Vitesse Semiconductor Corporation
vivante Vivante Corporation
vocore VoCore Studio
voipac Voipac Technologies s.r.o.
vot Vision Optical Technology Co., Ltd.
wd Western Digital Corp.
wetek WeTek Electronics, limited.
wexler Wexler
wi2wi Wi2Wi, Inc.
winbond Winbond Electronics corp.
winstar Winstar Display Corp.
wlf Wolfson Microelectronics
wm Wondermedia Technologies, Inc.
x-powers X-Powers
xes Extreme Engineering Solutions (X-ES)
xillybus Xillybus Ltd.
xlnx Xilinx
xunlong Shenzhen Xunlong Software CO.,Limited
ysoft Y Soft Corporation a.s.
zarlink Zarlink Semiconductor
zeitec ZEITEC Semiconductor Co., LTD.
zidoo Shenzhen Zidoo Technology Co., Ltd.
zii Zodiac Inflight Innovations
zte ZTE Corp.
zyxel ZyXEL Communications Corp.