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net-next: minor cleanups for bonding documentation 

The section titled "Configuring Bonding for Maximum Throughput" is
actually section twelve not thirteen, and there are a couple of words
spelled incorrectly.

Signed-off-by: Rick Jones <rick.jones2@hp.com>
Reviewed-by: Nicolas de Pesloüan <nicolas.2p.debian@free.fr>
Signed-off-by: Jay Vosburgh <fubar@us.ibm.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
hifive-unleashed-5.1
Rick Jones 2012-07-20 10:51:37 +00:00 committed by David S. Miller
parent 406a3c638c
commit f8b72d36d2
1 changed files with 3 additions and 3 deletions
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6
Documentation/networking/bonding.txt
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@ -1210,7 +1210,7 @@ options, you may wish to use the "max_bonds" module parameter,
documented above.
To create multiple bonding devices with differing options, it is
preferrable to use bonding parameters exported by sysfs, documented in the
preferable to use bonding parameters exported by sysfs, documented in the
section below.
For versions of bonding without sysfs support, the only means to
@ -1950,7 +1950,7 @@ access to fail over to. Additionally, the bonding load balance modes
support link monitoring of their members, so if individual links fail,
the load will be rebalanced across the remaining devices.
See Section 13, "Configuring Bonding for Maximum Throughput"
See Section 12, "Configuring Bonding for Maximum Throughput"
for information on configuring bonding with one peer device.
11.2 High Availability in a Multiple Switch Topology
@ -2620,7 +2620,7 @@ be found at:
https://lists.sourceforge.net/lists/listinfo/bonding-devel
Discussions regarding the developpement of the bonding driver take place
Discussions regarding the development of the bonding driver take place
on the main Linux network mailing list, hosted at vger.kernel.org. The list
address is: