Add SPDX license identifiers to all Make/Kconfig files which:
- Have no license information of any form
These files fall under the project license, GPL v2 only. The resulting SPDX
license identifier is:
GPL-2.0-only
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
This patch adds support for Maxim MAX31856 thermocouple
temperature sensor support.
More information can be found in:
https://www.maximintegrated.com/en/ds/MAX31856.pdf
NOTE: Driver support only Comparator Mode.
Signed-off-by: Paresh Chaudhary <paresh.chaudhary@rockwellcollins.com>
Signed-off-by: Matt Weber <matthew.weber@rockwellcollins.com>
Signed-off-by: Patrick Havelange <patrick.havelange@essensium.com>
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Formatting of Kconfig files doesn't look so pretty, so just
take damp cloth and clean it up.
Signed-off-by: Enrico Weigelt, metux IT consult <info@metux.net>
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Melexis has just released Infra Red temperature sensor MLX90632 used
for contact-less temperature measurement. Driver provides basic
functionality for reporting object (and ambient) temperature with
support for object emissivity.
Signed-off-by: Crt Mori <cmo@melexis.com>
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Environmental temperature sensor is a hid defined sensor,
it measures temperature.
More information can be found in:
http://www.usb.org/developers/hidpage/HUTRR39b.pdf
According to IIO ABI definition, IIO_TEMP data output unit is
milli degrees Celsius. Add the unit convert from degree to milli degree.
Signed-off-by: Song Hongyan <hongyan.song@intel.com>
Acked-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
This patch adds support for TI TMP007 - 16 bit IR thermopile sensor with integrated Math engine.
Sensor takes care of calculating the object temperature with the help of calibrated constants stored in non-volatile memory,
thereby reducing the calculation overhead.
Signed-off-by: Manivannan Sadhasivam <manivannanece23@gmail.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
Select IIO_BUFFER and IIO_TRIGGERED_BUFFER to compile maxim_thermocouple.
Signed-off-by: Alison Schofield <amsfield22@gmail.com>
Cc: Daniel Baluta <daniel.baluta@gmail.com>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
Add initial driver support for MAX6675, and MAX31855 thermocouple chips.
Cc: Marek Vasut <marex@denx.de>
Cc: Matt Porter <mporter@konsulko.com>
Signed-off-by: Matt Ranostay <mranostay@gmail.com>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
Support for TSYS02D temperature sensor
Signed-off-by: Ludovic Tancerel <ludovic.tancerel@maplehightech.com>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
Support for TSYS01 temperature sensor
Signed-off-by: Ludovic Tancerel <ludovic.tancerel@maplehightech.com>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
the TI TMP006 is a non-contact temperature sensor with I2C interface;
it measures the surface temperature of a distance object using a
thermopile to absorb IR energy emitted from the object
the sensor has two channels: IR sensor voltage (16-bit) and reference
temperature of the chip (14-bit); datasheet is here:
http://www.ti.com/lit/ds/symlink/tmp006.pdf
v2 (thanks to Grygorii Strashko, Lars-Peter Clausen, Jonathan Cameron
for review comments):
* power down device on driver remove
* use sign_extend32()
* style cleanup
* add comments what channel raw LSBs mean
* spelling of thermopile
Signed-off-by: Peter Meerwald <pmeerw@pmeerw.net>
Cc: Grygorii Strashko <grygorii.strashko@ti.com>
Cc: Lars-Peter Clausen <lars@metafoo.de>
Cc: Jonathan Cameron <jic23@kernel.org>
Cc: LM Sensors <lm-sensors@lm-sensors.org>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
Thomas Gleixner