[ Upstream commit 453802c463 ]
According to Technical Update TN-RCT-S0352A/E, MSIOF1 DMA can only be
used with SYS-DMAC0 on R-Car E3.
Fixes: 8517042060 ("arm64: dts: renesas: r8a77990: Add DMA properties to MSIOF nodes")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20200917132117.8515-2-geert+renesas@glider.be
Signed-off-by: Sasha Levin <sashal@kernel.org>
Update the 'vsps' property in the R-Car Gen3 SoC device tree files to
match what's in the documentation example.
Signed-off-by: Jacopo Mondi <jacopo+renesas@jmondi.org>
Reviewed-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Reviewed-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Sort nodes.
If node address is present
* Sort by node address, grouping all nodes with the same compat string
and sorting the group alphabetically.
Else
* Sort alphabetically
This should not have any run-time effect.
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Add CPG reset properties to DU node of E3 (r8a77990) SoC.
According to Laurent Pinchart, R-Car Gen3 reset is handled at the group
level so specifying one reset entry per group is sufficient.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Since the R8A77990 SoC uses DU{0,1}, the range from the base address to
the 0x4000 address is used.
This patch fixed it.
Fixes: 13ee2bfc54 ("arm64: dts: renesas: r8a77990: Add display output support")
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add the new renesas,companion property to the LVDS0 node to point to the
companion LVDS encoder LVDS1.
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: Jacopo Mondi <jacopo+renesas@jmondi.org>
Tested-by: Jacopo Mondi <jacopo+renesas@jmondi.org>
Reviewed-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Describe the dynamic power coefficient of A53 CPUs.
Based on work by Gaku Inami <gaku.inami.xw@bp.renesas.com> and others.
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
A single cooling device is described for all A53 CPUs as this
reflects that physically there is only one cooling device present.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Since the commit 233da2c9ec ("dt-bindings: phy: rcar-gen3-phy-usb2:
Revise #phy-cells property") revised the #phy-cells, this patch follows
the updated document for R-Car Gen3 and RZ/A2 SoCs.
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds CMT{0|1|2|3} device nodes for r8a77990 SoC.
Signed-off-by: Cao Van Dong <cv-dong@jinso.co.jp>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The compatible value renesas,rcar-gen3-csi2 was used while prototyping
the R-Car CSI-2 driver but was removed before the driver was merged.
Remove the only occurrence of the compatible value which manage to make
it upstream.
Fixes: ec70407ae7 ("arm64: dts: renesas: r8a77990: Add VIN and CSI-2 device nodes")
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
According to the R-Car Gen3 Hardware Manual Errata for Rev 1.50 of Feb
12, 2019, the DMA channels for SCIF5 are corrected from 16..47 to 0..15
on R-Car E3.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Fixes: a5ebe5e49a ("arm64: dts: renesas: r8a77990: Add SCIF-{0,1,3,4,5} device nodes")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch define OOP tables for all CPUs.
This allows CPUFreq to function.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The 'arm,armv8' compatible string is only for software models. It adds
little value otherwise and is inconsistently used as a fallback on some
platforms. Remove it from those platforms.
This fixes warnings generated by the DT schema.
Reported-by: Michal Simek <michal.simek@xilinx.com>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Will Deacon <will.deacon@arm.com>
Acked-by: Antoine Tenart <antoine.tenart@bootlin.com>
Acked-by: Nishanth Menon <nm@ti.com>
Acked-by: Maxime Ripard <maxime.ripard@bootlin.com>
Acked-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org>
Acked-by: Chanho Min <chanho.min@lge.com>
Acked-by: Krzysztof Kozlowski <krzk@kernel.org>
Acked-by: Masahiro Yamada <yamada.masahiro@socionext.com>
Acked-by: Gregory CLEMENT <gregory.clement@bootlin.com>
Acked-by: Thierry Reding <treding@nvidia.com>
Acked-by: Heiko Stuebner <heiko@sntech.de>
Acked-by: Simon Horman <horms+renesas@verge.net.au>
Acked-by: Tero Kristo <t-kristo@ti.com>
Acked-by: Wei Xu <xuwei5@hisilicon.com>
Acked-by: Liviu Dudau <liviu.dudau@arm.com>
Acked-by: Matthias Brugger <matthias.bgg@gmail.com>
Acked-by: Michal Simek <michal.simek@xilinx.com>
Acked-by: Scott Branden <scott.branden@broadcom.com>
Acked-by: Kevin Hilman <khilman@baylibre.com>
Acked-by: Chunyan Zhang <zhang.lyra@gmail.com>
Acked-by: Robert Richter <rrichter@cavium.com>
Acked-by: Jisheng Zhang <Jisheng.Zhang@synaptics.com>
Acked-by: Dinh Nguyen <dinguyen@kernel.org>
Signed-off-by: Rob Herring <robh@kernel.org>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
SCIF2 on R-Car E3 can be used with both DMAC1 and DMAC2.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Move the i2c nodes so that sub-nodes of the soc node are sorted by bus
address.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Move the pciec0 node so that sub-nodes of the soc node are
sorted by bus address.
This change has no run-time affect.
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
This patch adds the thermal device node and the thermal-zone for
the R8A77990 SoC.
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds I2C-DVFS device node for the R8A77990 SoC.
v2
* Drop aliases update as in upstream it is not required to configure the
BD9571 PMIC for DDR backup, nor is the use of i2c are aliases desired.
* Do not describe the device as compatible with "renesas,rcar-gen3-iic" or
"renesas,rmobile-iic" fallback compat strings. The absence of automatic
transmission registers leads us to declare the r8a77990 IIC controller as
incompatible.
v2.1
* Reduced register range to reflect documentation
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds CAN0,1 and CANFD device nodes for the r8a77990 SoC
and enables CANFD connected to CN10 on the E3 Ebisu board using the
R8A77990 SoC.
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Acked-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds PCI express channel 0 device node to the R8A77990 SoC
and enables PCIEC0 PCI express controller on the Ebisu board.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The VIN driver bindings dictates fixed numbering for VIN endpoints connected
to CSI-2 endpoints, even when a single endpoint exists.
Without proper endpoint numbering the VIN driver fails to probe.
Based on a patch in BSP from Koji Matsuoka <koji.matsuoka.xm@renesas.com>
Fixes: ec70407ae7 ("arm64: dts: renesas: r8a77990: Add VIN and CSI-2 device nodes")
Signed-off-by: Koji Matsuoka <koji.matsuoka.xm@renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Jacopo Mondi <jacopo+renesas@jmondi.org>
Reviewed-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds SDHI{0,1,3} device nodes for the r8a77990 SoC
and enables SD card slot connected to SDHI0, micro SD card slot
connected to SDHI1 and eMMC connected to SDHI3 on the Ebisu board
using the R8A77990 SoC.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Cc: Geert Uytterhoeven <geert+renesas@glider.be>
Cc: Simon Horman <horms+renesas@verge.net.au>
Cc: Wolfram Sang <wsa@the-dreams.de>
Cc: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Cc: linux-renesas-soc@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Acked-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds the device nodes for all HSCIF serial ports to
the R8A77990 SoC.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds Audio-DMAC0 device node and Sound device node
for the R8A77990 SoC.
Based on work by Takeshi Kihara and Hai Nguyen Pham.
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
[simon: dropped include update, which is already present]
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds/enables USB2.0 peripheral for R-Car [DE]3 boards.
R-Car E3 Ebisu board connects the ID pin to the SoC, so this adds
a group "usb0_id" into usb0_pins node. Also, to use SW15 pin 3 side,
this patch adds vbus0_usb2 node on r8a77990-ebisu.dts.
R-Car D3 Draak board doesn't connect the ID pin, so this adds
"renesas,no-otg-pins" property into usb2_phy0 node.
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Hook up the R-Car E3 AVB device to IPMMU-DS0 16 as described in
the data sheet.
Signed-off-by: Magnus Damm <damm@opensource.se>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds the device nodes for SCIF-{0,1,3,4,5} serial ports to
the R8A77990 SoC.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds a device node for the Interrupt Controller for External
Devices (INTC-EX) on R-Car E3, which serves external IRQ pins IRQ[0-5].
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The R8A77990 (E3) platform has one RGB output and two LVDS outputs
connected to the DU. Add the DT nodes for the DU, LVDS encoders and
supporting VSP and FCP.
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Tested-by: Jacopo Mondi <jacopo+renesas@jmondi.org>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
R-Car Gen3 SoCs need to enable/deassert clocks/resets of both usb 2.0
host (included phy) and peripheral. Otherwise, other side device
cannot work correctly. So, this patch revises properties of clocks
and resets. After that, each device driver can enable/deassert
clocks/resets by its self.
Notes:
- To work the renesas_usbhs driver correctly when host side drivers
are disabled and the renesas_usbhs driver doesn't have multiple
clock management, this patch doesn't change the order of the clocks
property in each hsusb node.
- This patch doesn't have any side-effects even if the renesas_usbhs
driver doesn't have reset_control and multiple clock management.
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
For R-Car E3 hook up SYS-DMAC0, SYS-DMAC1 and SYS-DMAC2 to
IPMMU-DS0 and IPMMU-DS1 in same way as for R-Car H3.
This follows the R-Car Gen3 Rev.1.00 (April 2018) datasheet.
Signed-off-by: Magnus Damm <damm@opensource.se>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add the device nodes for all MSIOF SPI controllers, incl. clocks, power
domains, and resets properties.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add the device node for the external SCIF_CLK, and describe the clock
inputs for the Baud Rate Generator for External Clock (BRG) for SCIF2,
which can increase serial clock accuracy.
The presence of the SCIF_CLK crystal and its clock frequency depend on
the actual board.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
[geert: Enhance patch description]
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Use the SoC-specific CPG/MSSR include file to allow future use of
R8A77990_CLK_* symbols.
Replace the hardcoded power domain indices by R8A77990_PD_* symbols.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds PWM device nodes and enables PWM3 and PWM5 for
R-Car E3 Ebisu board. These devices are used for backlight control.
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Browsing the DTS for all the R-Car SoCs with similar part numbers
makes my head hurt, so to improve the user friendliness of the
DTS code base include R-Car product name in each DTSI file.
Product names are derived from
Documentation/devicetree/bindings/arm/shmobile.txt
Signed-off-by: Magnus Damm <damm+renesas@opensource.se>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds and USB3.0 host device node and enable it for
R-Car E3 Ebisu board.
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Geert Uytterhoeven