Looks like I missed the ranges for am335x epwmss. Let's set it up the
same way as for am437x and dra7.
Fixes: 87fc89ced3 ("ARM: dts: am335x: Move l4 child devices to probe
them with ti-sysc")
Tested-by: Peter Ujfalusi <peter.ujfalusi@ti.com>
Signed-off-by: Tony Lindgren <tony@atomide.com>
Earlier attempt to move am335x mcasp to probe with ti-sysc
interconnect target module caused audio to stop working and and
the dts changes were reverted by commit 5d2632a577 ("ARM: dts:
Revert am335x mcasp ti-sysc changes").
Turns out we were missing the l3 data port ranges for mcasp. This
caused mcasp dma to attempt to use wrong port address. So let's
try again essentially reverting the earlier revert and adding the
missing l3 data port ranges.
Tested-by: Peter Ujfalusi <peter.ujfalusi@ti.com>
Signed-off-by: Tony Lindgren <tony@atomide.com>
Without this McASP FIFO would constantly underflow. EDMA
test via dmatest works though.
Let's revert the change for now until we know the root cause.
Reported-by: Peter Ujfalusi <peter.ujfalusi@ti.com>
Tested-by: Peter Ujfalusi <peter.ujfalusi@ti.com>
Signed-off-by: Tony Lindgren <tony@atomide.com>
With l4 interconnect hierarchy and ti-sysc interconnect target module
data in place, we can simply move all the related child devices to
their proper location and enable probing using ti-sysc.
In general the first child device address range starts at range 0
from the ti-sysc interconnect target so the move involves adjusting
the child device reg properties for that.
In case of any regressions, problem devices can be reverted to probe
with legacy platform data as needed by moving them back and removing
the related interconnect target module node.
Note that we are not yet moving dss or wkup_m3, those will be moved
later after some related driver changes.
Cc: Dave Gerlach <d-gerlach@ti.com>
Cc: Keerthy <j-keerthy@ti.com>
Cc: Tero Kristo <t-kristo@ti.com>
Signed-off-by: Tony Lindgren <tony@atomide.com>
Similar to commit 8f42cb7f64 ("ARM: dts: omap4: Add l4 interconnect
hierarchy and ti-sysc data"), let's add proper interconnect hierarchy
for l4 interconnect instances with the related ti-sysc interconnect
module data as in Documentation/devicetree/bindings/bus/ti-sysc.txt.
Using ti-sysc driver binding allows us to start dropping legacy platform
data in arch/arm/mach-omap2/omap*hwmod*data.c files later on in favor of
ti-sysc dts data.
This data is generated based on platform data from a booted system
and the interconnect acces protection registers for ranges. To avoid
regressions, we initially validate the device tree provided data
against the existing platform data on boot.
Note that we cannot yet include this file from the SoC dtsi file until
the child devices are moved to their proper locations in the
interconnect hierarchy in the following patch. Otherwise we would have
the each module probed twice.
Cc: Dave Gerlach <d-gerlach@ti.com>
Cc: Keerthy <j-keerthy@ti.com>
Cc: Tero Kristo <t-kristo@ti.com>
Signed-off-by: Tony Lindgren <tony@atomide.com>
