thermal: Bind cooling devices with the correct arguments
When binding cooling devices to thermal zones created from the device tree the minimum and maximum cooling states are in the wrong order leading to failure to bind. Fix the order of cooling states in the call to thermal_zone_bind_cooling_device to fix this. Cc:Zhang Rui <rui.zhang@intel.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Reviewed-by: Stephen Boyd <sboyd@codeaurora.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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@ -156,8 +156,8 @@ static int of_thermal_bind(struct thermal_zone_device *thermal,
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ret = thermal_zone_bind_cooling_device(thermal,
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tbp->trip_id, cdev,
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tbp->min,
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tbp->max);
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tbp->max,
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tbp->min);
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if (ret)
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return ret;
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}
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