net-next: minor cleanups for bonding documentation
The section titled "Configuring Bonding for Maximum Throughput" is actually section twelve not thirteen, and there are a couple of words spelled incorrectly. Signed-off-by: Rick Jones <rick.jones2@hp.com> Reviewed-by: Nicolas de Pesloüan <nicolas.2p.debian@free.fr> Signed-off-by: Jay Vosburgh <fubar@us.ibm.com> Signed-off-by: David S. Miller <davem@davemloft.net>
This commit is contained in:
parent
406a3c638c
commit
f8b72d36d2
|
@ -1210,7 +1210,7 @@ options, you may wish to use the "max_bonds" module parameter,
|
||||||
documented above.
|
documented above.
|
||||||
|
|
||||||
To create multiple bonding devices with differing options, it is
|
To create multiple bonding devices with differing options, it is
|
||||||
preferrable to use bonding parameters exported by sysfs, documented in the
|
preferable to use bonding parameters exported by sysfs, documented in the
|
||||||
section below.
|
section below.
|
||||||
|
|
||||||
For versions of bonding without sysfs support, the only means to
|
For versions of bonding without sysfs support, the only means to
|
||||||
|
@ -1950,7 +1950,7 @@ access to fail over to. Additionally, the bonding load balance modes
|
||||||
support link monitoring of their members, so if individual links fail,
|
support link monitoring of their members, so if individual links fail,
|
||||||
the load will be rebalanced across the remaining devices.
|
the load will be rebalanced across the remaining devices.
|
||||||
|
|
||||||
See Section 13, "Configuring Bonding for Maximum Throughput"
|
See Section 12, "Configuring Bonding for Maximum Throughput"
|
||||||
for information on configuring bonding with one peer device.
|
for information on configuring bonding with one peer device.
|
||||||
|
|
||||||
11.2 High Availability in a Multiple Switch Topology
|
11.2 High Availability in a Multiple Switch Topology
|
||||||
|
@ -2620,7 +2620,7 @@ be found at:
|
||||||
|
|
||||||
https://lists.sourceforge.net/lists/listinfo/bonding-devel
|
https://lists.sourceforge.net/lists/listinfo/bonding-devel
|
||||||
|
|
||||||
Discussions regarding the developpement of the bonding driver take place
|
Discussions regarding the development of the bonding driver take place
|
||||||
on the main Linux network mailing list, hosted at vger.kernel.org. The list
|
on the main Linux network mailing list, hosted at vger.kernel.org. The list
|
||||||
address is:
|
address is:
|
||||||
|
|
||||||
|
|
Loading…
Reference in a new issue