(module TSSOP-8_3x3mm_Pitch0.65mm_HandSoldering (layer F.Cu) (tedit 5887DC14) (descr "TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)") (tags "SSOP 0.65") (attr smd) (fp_text reference REF** (at 0 -2.55) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value TSSOP-8_3x3mm_Pitch0.65mm_HandSoldering (at 0 2.55) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.524 -1.524) (end 1.524 -1.524) (layer F.Fab) (width 0.1)) (fp_line (start 1.524 -1.524) (end 1.524 1.524) (layer F.Fab) (width 0.1)) (fp_line (start 1.524 1.524) (end -1.524 1.524) (layer F.Fab) (width 0.1)) (fp_line (start -1.524 1.524) (end -1.524 -1.524) (layer F.Fab) (width 0.1)) (fp_line (start -3.429 -1.778) (end -3.429 1.778) (layer F.CrtYd) (width 0.05)) (fp_line (start 3.429 -1.778) (end 3.429 1.778) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.429 -1.778) (end 3.429 -1.778) (layer F.CrtYd) (width 0.05)) (fp_line (start -3.429 1.778) (end 3.429 1.778) (layer F.CrtYd) (width 0.05)) (fp_line (start -1.651 -1.651) (end -1.651 -1.524) (layer F.SilkS) (width 0.12)) (fp_line (start 1.651 -1.651) (end 1.651 -1.397) (layer F.SilkS) (width 0.12)) (fp_line (start 1.651 1.651) (end 1.651 1.397) (layer F.SilkS) (width 0.15)) (fp_line (start -1.651 1.651) (end -1.651 1.397) (layer F.SilkS) (width 0.15)) (fp_line (start -1.651 -1.651) (end 1.651 -1.651) (layer F.SilkS) (width 0.12)) (fp_line (start -1.651 1.651) (end 1.651 1.651) (layer F.SilkS) (width 0.15)) (fp_line (start -1.651 -1.524) (end -2.794 -1.524) (layer F.SilkS) (width 0.12)) (pad 1 smd rect (at -2.4 -0.975) (size 1.6 0.45) (layers F.Cu F.Paste F.Mask)) (pad 2 smd rect (at -2.4 -0.325) (size 1.6 0.45) (layers F.Cu F.Paste F.Mask)) (pad 3 smd rect (at -2.4 0.325) (size 1.6 0.45) (layers F.Cu F.Paste F.Mask)) (pad 4 smd rect (at -2.4 0.975) (size 1.6 0.45) (layers F.Cu F.Paste F.Mask)) (pad 5 smd rect (at 2.4 0.975) (size 1.6 0.45) (layers F.Cu F.Paste F.Mask)) (pad 6 smd rect (at 2.4 0.325) (size 1.6 0.45) (layers F.Cu F.Paste F.Mask)) (pad 7 smd rect (at 2.4 -0.325) (size 1.6 0.45) (layers F.Cu F.Paste F.Mask)) (pad 8 smd rect (at 2.4 -0.975) (size 1.6 0.45) (layers F.Cu F.Paste F.Mask)) (model Housings_SSOP.3dshapes/TSSOP-8_3x3mm_Pitch0.65mm.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) )